Subsurface Etch Video

A video file showing a non-line-of-sight, subsurface SiC etch in progress. This was recorded using the in-situ microscope with a 515nm band block filter placed in front of the camera to block all laser light. The video starts after a microchannel has already been etched to a depth of about 250 microns below the surface. All the etching in the video occurs in a plane parallel to the surface of the SiC wafer, and the microchannel is about 1 micron in diameter. The etch is sped up in the video by close to 100X.