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posted on 2024-06-28, 17:24 authored by Hanfu Wang, Ziqi Liang, Junhui Tang, Dongwei Wang, Bo Xu, Lingju Guo, Yanjun Guo, Weiguo Chu

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DOI - Is supplement to Thermal Characterization of Thin Films: A Chip-based Approach for In-Plane Properties Analysis

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Physical sciences

Keywords

In-plane thermal conductivity Thin films 3ω technique Computational simulations

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