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posted on 2025-03-24, 04:03 authored by Yang He, Shun Wan, Shi Zhou, Zeming Huang, Yongwei Chang, Yu Yang, Xiaowu Gao, Yongze Xu, Jinfeng Yang, Shang Gao, Dengke Ma, Yan Zhou, Huarui Sun
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    Applied Physics Letters

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    Keywords

    hydrophilic bondingsurface activated bondingresidual stressthermal transportsilicon-on-insulator

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    CC BY 4.0

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