Supplemental Information

Supplementary information contains the temperature dependent heat capacity used in our thermal model, thickness of the TiN films for all the samples, the temperature dependent thermal conductivity of the substrates measured in our TDTR experiments, details on the calculation of the temperature dependent electronic thermal conductivity of TiN, details on error analysis including sensitivity and contour plots, data from various TiN/diamond TDTR experiments, temperature dependent data and thermal model fits for all our samples, details of the computational models for DMM, elastic limit and Gmax theory curves, additional figure comparing interface conductance for TiN/diamond measured in this study to temperature dependent interface conductance reported in literature, comparison of experimental interface conductance for Pd/GaN reported by Huang et al.13 with the elastic model and Gmax theory curves.