Supplement Number 1

Fig. S1: The device structure; Fig. S2: The resistance at the first day for different metal electrodes on NdNiO3 and SmNiO3; Fig. S3: R-T for two-terminal metal/NdNiO3 device with relatively stable metals (Ag, Au, Pd, and Ni) as electrodes; Fig. S4: R-T for two-terminal metal/NdNiO3 device with reactive metals (Hf, Ta, Nb, Ti, Cr, W, and Mo) as electrodes; Fig. S5: R-T for two-terminal metal/Nd0.75Sm0.25NiO3 device with metals (Hf, Ta, Ag, Mo, Cu, Co, Ni, and Pt) as electrodes; Fig. S6: Microfabrication process; Fig. S7: Rt/R0-t for Pt electrode at room temperature and Ag, Cu, Ru, Co, Ni, and Pt electrodes by heating to 80 {degree sign}C; Table S1-S3: The reported room-temperature resistivity of intermediate oxides of metals Ru, Co, and Cr.