figure
posted on 2024-01-10, 12:55 authored by M. Stabentheiner, P. Diehle, S. Hü, bner, M.Lejoyeux, F. Altmann, R. Neumann, A.A. Taylor, D.Pogany, and C. OstermaierFIG S-2: SEM images of different steps during the cross-sectional lamella preparation. (a) protection layers are placed on top and at the
bottom of the planar lamella as stabilization. (b) the lamella after FIB milling before lift-out. (c) manipulators during the in-situ lift-out
procedure. (d) STEM overview image of the final sample after polishing.<p></p>
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