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FIG S-1

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posted on 2024-01-10, 12:55 authored by M. Stabentheiner, P. Diehle, S. Hü, bner, M.Lejoyeux, F. Altmann, R. Neumann, A.A. Taylor, D.Pogany, and C. Ostermaier
FIG S-1: Laser and FIB preparation of the test devices. (a) The two devices are milled out with a laser and placed on a Cu grid. (b) Plasma FIB milling close to the localized failure positions.

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