Supplementary materials

Name: Supplementary materials
Published: 2024-07-11T12:01:24+00:00
License: https://creativecommons.org/licenses/by-nc/4.0/
Keywords: Flow boiling, Scalability, Hybrid wall, Electronics cooling, Dielectric coolant

dataset

posted on 2024-07-11, 12:01 authored by Kai Luo, Fahim Foysal, Wei Chang, Enrico Santi, Chen Li

Revised supplementary materials for the manuscript, including fabrication process, experiment setup and data reduction, and the summary of flow-boiling heat sinks using HFE-7100.